The company has an independent and large-scale quality management and technology research and development team. They follow industry international standards such as IPC-6012, IPC-TM-650, and IPC-A-600G to set their own requirements. They have equipped with advanced quality inspection equipment such as peel strength tester, metallographic microscope, line width detector, A01 optical inspection machine, and fully automatic tester, providing an effective guarantee for the stability of product quality.
Meanwhile, the enterprise has implemented measures such as adding the vacuum etching process, introducing high - resolution automatic photoplotting equipment, and adjusting the arrangement and combination of water jets in the key DMSE tanks. As a result, it has now achieved multiple leading indicators in the industry's process technology. Currently, the maximum number of layers of the product is eight, the completed board thickness is 3.2mm, the minimum finished product hole diameter is 0.20 mm, the line width of the inner and outer layers is 3 mils, the minimum isolation ring of the inner layer is ≤7 mils, the maximum aspect ratio of electroplating is 1:10, the conventional solder mask bridge is 4 mils, the solder mask plugging hole capacity is ≤0.50 mm, the steel thickness on the finished product surface is 402 ounces, and the impedance control range is ±10%. Without special instructions from customers, the company can provide three different surface treatment processes, namely hot air solder leveling, electroless gold plating, and organic solderability preservatives. To meet customers' requirements for special products, the company has completed the research and development of technologies such as blind slots, blind holes, and trumpet - shaped half - holes.