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High Density Interconnects (HDI) Board
High-Density Interconnects (HDI) boards represent the cutting-edge of miniaturization and high integration in printed circuit board technology. Their core definition lies in utilizing advanced structures such as blind and buried microvias to achieve interconnect density far exceeding that of traditional PCBs within a smaller unit area. This technology's most notable feature is its support for extremely fine routing, such as ultra-fine line widths and spacings as fine as 3 mils (0.075mm), and a thickness-to-aperture ratio of up to 10:1. This allows for the construction of complex circuit architectures with up to 32 layers within board thicknesses ranging from 0.3mm to 6mm. A variety of surface finishes, from tin-spraying to nickel-plated gold, are available to meet demanding electrical performance requirements. Consequently, HDI boards have become the preferred choice for modern electronic devices that strive for lightweight, thin, short, and compact design. They are widely used in core motherboards for 5G smartphones, micromodules for high-end wearables, and high-reliability precision circuit systems in the aerospace industry, providing crucial technical support for enhancing the functionality and miniaturization of electronic devices.
