Rigid-flex PCBs combine structural strength and dynamic flex capabilities by laminating a rigid FR4 substrate with a flexible polyimide material, enabling three-dimensional wiring and reducing connector usage. Their unique hybrid structure ensures stability in critical areas while providing exceptional flexibility (with a minimum bend radius of 0.5mm) where bending is required. They are widely used in high-precision applications such as folding devices, aerospace electronics, medical endoscopes, and industrial robotics. This design reduces assembly nodes by over 30%, significantly improving signal integrity and seismic resistance. It is an innovative solution for complex spatial layouts and high reliability requirements, and is particularly suitable for intelligent hardware products that require both static fixation and dynamic flexing.
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Materials |
FR-4, aluminum, ceramic, metal, copper, high-frequency, rigid-flex, halogen-free |
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Board thickness |
0.3-6mm |
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Copper thickness |
0.5oz-5oz |
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Layers |
1-32 |
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Place of origin |
Anhui, China |
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Surface finish |
Standard HASL, lead-free HASL, OSP, immersion nickel/gold, blue glue, immersion silver, immersion tin |
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Minimum aperture |
0.25mm |
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Minimum trace width |
3mil (0.075mm) |
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Minimum trace spacing |
0.075mm |
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Board thickness to aperture ratio |
10:1 |