Flexible PCBs, made from flexible substrates such as polyimide (PI) or polyester (PET), are thin, bendable, resistant to high and low temperatures (-200°C to 400°C), and vibration-resistant, enabling three-dimensional wiring. With a dynamic flex lifespan exceeding one million cycles, they significantly save space and reduce device weight, making them widely used in foldable phones, wearable devices, medical devices, automotive electronics, and aerospace. Flexible PCBs support high-density interconnect designs, combining excellent signal transmission performance with electromagnetic shielding. They are key components for the miniaturization of smart devices and innovation in mobile electronics, and are particularly well-suited for precision applications requiring repeated bending or complex assembly.
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Materials |
FR-4, aluminum, ceramic, metal, copper, high-frequency, rigid-flex, halogen-free |
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Board thickness |
0.3-6mm |
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Copper thickness |
0.5oz-5oz |
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Layers |
1-32 |
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Place of origin |
Anhui, China |
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Surface finish |
Standard HASL, lead-free HASL, OSP, immersion nickel/gold, blue glue, immersion silver, immersion tin |
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Minimum aperture |
0.25mm |
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Minimum trace width |
3mil (0.075mm) |
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Minimum trace spacing |
0.075mm |
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Board thickness to aperture ratio |
10:1 |
HighFlex Flexible PCB (FPC) is manufactured on thin flexible dielectric substrates, designed for repeated bending, folding and dynamic-movement conditions. It supports 3D conformal routing to save device internal space and reduce overall weight. Two main substrate options including PI and PET are available. Material selection, bending cycle requirements and assembly compatibility should be confirmed according to end-product working conditions and engineering assessment.
Q: What is the main difference between PI FPC and PET FPC?
A: PI FPC fits dynamic repeated folding and high-temperature working environments. PET is cost-effective and only suitable for static bending without millions of flexing cycles.