High-power PCBs utilize thick copper foil (3oz-20oz) and a highly heat-resistant base material, offering exceptional current-carrying capacity (over 100A) and high-temperature resistance (TG value ≥180°C). They are optimized for high-current, high-load scenarios. By optimizing wiring design and heat dissipation channels (with built-in metal matrix or ceramic fillers), they effectively reduce impedance heat loss, solving heat dissipation challenges in power converters, new energy inverters, industrial motor drives, and electric vehicle charging modules. This board supports ultra-high ampere transmission and transient surge protection, combining structural strength with electrical stability. It is a core support for efficient energy transmission in high-power electronic devices such as photovoltaic systems, rail transit, and heavy machinery.
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Materials |
FR-4, aluminum, ceramic, metal, copper, high-frequency, rigid-flex, halogen-free |
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Board thickness |
0.3-6mm |
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Copper thickness |
0.5oz-5oz |
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Layers |
1-32 |
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Place of origin |
Anhui, China |
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Surface finish |
Standard HASL, lead-free HASL, OSP, immersion nickel/gold, blue glue, immersion silver, immersion tin |
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Minimum aperture |
0.25mm |
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Minimum trace width |
3mil (0.075mm) |
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Minimum trace spacing |
0.075mm |
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Board thickness to aperture ratio |
10:1 |
A double-sided high-power PCB is a two-layer board designed for high-current conduction and heat-management applications. It typically features heavier copper weights (e.g., 2 oz and above) to reduce conductor resistance and heat generation. Copper weight, trace width, substrate grade, and thermal design should be confirmed against the customer's design files and engineering review, based on the actual current and temperature-rise requirements of the application.
Q: What should be considered when designing a high-power PCB?
A: Copper weight, trace width, thermal vias, substrate thermal performance, and heat-dissipation structure should be evaluated together based on the current and temperature-rise requirements of the application.