High-power PCBs utilize thick copper foil (3oz-20oz) and a highly heat-resistant base material, offering exceptional current-carrying capacity (over 100A) and high-temperature resistance (TG value ≥180°C). They are optimized for high-current, high-load scenarios. By optimizing wiring design and heat dissipation channels (with built-in metal matrix or ceramic fillers), they effectively reduce impedance heat loss, solving heat dissipation challenges in power converters, new energy inverters, industrial motor drives, and electric vehicle charging modules. This board supports ultra-high ampere transmission and transient surge protection, combining structural strength with electrical stability. It is a core support for efficient energy transmission in high-power electronic devices such as photovoltaic systems, rail transit, and heavy machinery.
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Materials |
FR-4, aluminum, ceramic, metal, copper, high-frequency, rigid-flex, halogen-free |
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Board thickness |
0.3-6mm |
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Copper thickness |
0.5oz-5oz |
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Layers |
1-32 |
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Place of origin |
Anhui, China |
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Surface finish |
Standard HASL, lead-free HASL, OSP, immersion nickel/gold, blue glue, immersion silver, immersion tin |
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Minimum aperture |
0.25mm |
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Minimum trace width |
3mil (0.075mm) |
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Minimum trace spacing |
0.075mm |
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Board thickness to aperture ratio |
10:1 |