Double-sided blue gold-plated boards, featuring a high-saturation blue solder mask layer combined with double-sided gold plating technology, have a unique blue appearance that combines visual recognition and product differentiation advantages. They are suitable for the appearance customization requirements of high-end electronic devices. The gold-plated surface has excellent electrical conductivity, resistance to oxidation and wear, which can ensure high-frequency welding and long-term stable operation, effectively reducing contact resistance and signal loss. The double-sided circuit layout supports streamlined functional design, with precise control of line width and spacing, and is compatible with surface mount and through-hole packaging, meeting the circuit requirements of small and medium-power electronic devices. The core advantages lie in the blue customized appearance, high reliability of gold plating, and the practical adaptability of the double-sided layout. They are widely used in smart wearable devices, high-end consumer electronic accessories, communication modules, etc., and are a high-quality PCB solution that balances appearance customization and practical performance.
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Material |
FR-4, aluminium-based, ceramic, metal, copper-based, high-frequency, rigid-flex combined, halogen-free |
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Board thickness |
0.3 - 6mm |
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Copper thickness |
0.5oz - 5oz |
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Number of layers |
1 - 32 layers |
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Origin |
Anhui, China |
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Surface treatment |
Ordinary tin plating, lead-free tin plating, OSP, nickel/gold plating, blue tape, silver plating, tin plating |
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Minimum hole diameter |
0.25mm |
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Minimum line width |
3mil (0.075mm) |
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Minimum line spacing |
0.075mm |
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Ratio of board thickness to hole diameter |
10:4 |