Double-sided gold-plated PCBs utilize an electroless immersion gold (ENIG) process to create uniform gold and nickel layers on both sides of the PCB. This process combines excellent oxidation resistance, flatness, and solderability, making it particularly suitable for high-precision, high-reliability electronic devices. The gold-plated layer is wear-resistant and corrosion-resistant, making it suitable for multiple reflow soldering cycles and wire bonding. It is widely used in communications equipment, industrial control motherboards, medical equipment, and high-end consumer electronics. This process eliminates issues such as uneven tin spraying and the susceptibility of OSP to oxidation, while also supporting fine-pitch BGA and QFN packages, making it an ideal choice for high-performance PCBs.
|
Material |
FR-4 |
|
Supplier |
Shengyi |
|
Board Thickness |
1.6mm |
|
Finished Copper Thickness |
36µm |
|
Solder Mask |
Royal Blue |
|
Texture |
White |
|
Surface Treatment |
Gold |
|
Finished Dimensions |
199mm x 180mm |
|
Trace Width |
0.15mm |
|
Trace Spacing |
0.12mm |
|
Minimum Hole |
0.3mm |
Double-Sided Gold-Plated PCB, also known as double-sided ENIG PCB, applies electroless nickel immersion gold surface finish on both circuit sides of a 2-layer board. It provides anti-oxidation performance and flat pad surfaces. Substrate grade, nickel-gold thickness and assembly requirements shall be confirmed based on customer design and application environment.
Q: What are the main differences between ENIG, HASL-LF and OSP?
A: ENIG provides ultra-flat pads and long anti-oxidation shelf-life. HASL-LF may bring uneven tin thickness, while OSP is cost-sensitive but prone to oxidation during long-time storage.