Double-sided blue gold-plated board, using chemical gold plating technology, achieves ultra-flat pads while ensuring excellent signal transmission quality and can perfectly support the stable welding of fine-pitch component elements, effectively reducing the risk of short circuits. Its surface has a good nickel layer barrier effect, which can significantly inhibit copper migration and enhance the long-term reliability of the product in harsh environments. This board is an ideal carrier for applications such as communication radio frequency modules, precision medical electronics, high-end embedded systems, and high-speed digital circuits, which have extremely high requirements for signal integrity and long-term stability.
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Material |
FR-4, aluminium-based, ceramic, metal, copper-based, high-frequency, rigid-flex combined, halogen-free |
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Board thickness |
0.3 - 6mm |
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Copper thickness |
0.5oz - 5oz |
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Number of layers |
1 - 32 layers |
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Origin |
Anhui, China |
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Surface treatment |
Ordinary tin plating, lead-free tin plating, OSP, nickel/gold plating, blue tape, silver plating, tin plating |
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Minimum hole diameter |
0.25mm |
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Minimum line width |
3mil (0.075mm) |
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Minimum line spacing |
0.075mm |
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Thickness-to-diameter ratio of holes |
10:16 |