Double-sided green lead-free soldered board, featuring a high adhesion green solder mask layer combined with lead-free matte soldering process. The green appearance conforms to the common visual standards in the electronics manufacturing industry. The soldering surface undergoes special passivation treatment, forming a dense protective film, which effectively enhances the product's service life in outdoor and industrial environments. The board body is made of high Tg (170℃) flame-retardant FR-4 substrate, equipped with 1oz-2oz flexible copper thickness configuration. The circuit design supports 3mil/3mil fine line width and spacing, compatible with BGA, QFP and other precision packaging and mixed assembly with conventional through-hole components. It also has excellent anti-buckling performance. After undergoing -40℃ to 125℃ high and low temperature cycling tests, it maintains structural stability without any obvious deformation.
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Material |
FR-4, aluminium-based, ceramic, metal, copper-based, high-frequency, rigid-flex combined, halogen-free |
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Board thickness |
0.3 - 6mm |
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Copper thickness |
0.5oz - 5oz |
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Number of layers |
1 - 32 layers |
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Origin |
Anhui, China |
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Surface treatment |
Ordinary tin plating, lead-free tin plating, OSP, nickel/gold plating, blue tape, silver plating, tin plating |
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Minimum hole diameter |
0.25mm |
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Minimum line width |
3mil (0.075mm) |
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Minimum line spacing |
0.075mm |
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Thickness-to-diameter ratio of holes |
10:15 |