Double-sided green lead-free soldered board, featuring the industry-standard green solder mask layer combined with high-gloss bright lead-free soldering process. The green appearance precisely fits the visual positioning system of the automated production line, significantly improving the AOI detection recognition rate and soldering accuracy. The soldering surface layer is uniform and full, enabling stable welding in high-speed soldering production lines and compatible with various conventional electronic component packages. The board body is made of high thermal conductivity FR-4 substrate, combined with an optimized heat dissipation circuit layout, which can quickly conduct working heat and effectively reduce the temperature rise of components.
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Material |
FR-4, aluminium-based, ceramic, metal, copper-based, high-frequency, rigid-flex combined, halogen-free |
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Board thickness |
0.3 - 6mm |
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Copper thickness |
0.5oz - 5oz |
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Number of layers |
1 - 32 layers |
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Origin |
Anhui, China |
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Surface treatment |
Ordinary tin plating, lead-free tin plating, OSP, nickel/gold plating, blue tape, silver plating, tin plating |
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Minimum hole diameter |
0.25mm |
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Minimum line width |
3mil (0.075mm) |
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Minimum line spacing |
0.075mm |
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Thickness-to-diameter ratio of holes |
10:14 |