Double-sided black OSP PCB board, using the anti-oxidation (OSP) surface treatment process, forms a smooth and uniform protective film on the copper pads, featuring excellent solderability and good coplanarity. It is particularly suitable for precise welding of fine-pitch components. The black solder mask layer not only gives the product a unique visual sophistication but also effectively conceals the circuitry. It is an ideal choice for consumer electronics, smart home, industrial control, and automotive electronics, among others.
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Material |
FR-4, aluminium-based, ceramic, metal, copper-based, high-frequency, rigid-flex combined, halogen-free |
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Board thickness |
0.3 - 6mm |
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Copper thickness |
0.5oz - 5oz |
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Number of layers |
1 - 32 layers |
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Origin |
Anhui, China |
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Surface treatment |
Ordinary tin plating, lead-free tin plating, OSP, nickel/gold plating, blue tape, silver plating, tin plating |
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Minimum hole diameter |
0.25mm |
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Minimum line width |
3mil (0.075mm) |
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Minimum line spacing |
0.075mm |
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Thickness-to-diameter ratio of holes |
10:11 |