Double-sided black OSP PCB board, using the anti-oxidation (OSP) surface treatment process, forms a smooth and uniform protective film on the copper pads, featuring excellent solderability and good coplanarity. It is particularly suitable for precise welding of fine-pitch components. The black solder mask layer not only gives the product a unique visual sophistication but also effectively conceals the circuitry. It is an ideal choice for consumer electronics, smart home, industrial control, and automotive electronics, among others.
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Material |
FR-4, aluminium-based, ceramic, metal, copper-based, high-frequency, rigid-flex combined, halogen-free |
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Board thickness |
0.3 - 6mm |
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Copper thickness |
0.5oz - 5oz |
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Number of layers |
1 - 32 layers |
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Origin |
Anhui, China |
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Surface treatment |
Ordinary tin plating, lead-free tin plating, OSP, nickel/gold plating, blue tape, silver plating, tin plating |
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Minimum hole diameter |
0.25mm |
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Minimum line width |
3mil (0.075mm) |
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Minimum line spacing |
0.075mm |
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Thickness-to-diameter ratio of holes |
10:11 |
A double-sided black lead-free solder board is a two-layer PCB with a black LPI solder mask and a lead-free HASL (Hot Air Solder Leveling) surface finish. The lead-free tin coating provides solderable pads suitable for general SMT and through-hole assembly while complying with lead-free (RoHS) requirements. The black solder mask is selected for specific appearance or application needs. Board thickness, copper weight, and finish requirements should be confirmed against the customer's design files and engineering review.
Q: What is the difference between lead-free HASL and ENIG?
A: Lead-free HASL provides a solderable tin coating at lower cost, while ENIG offers a flatter pad surface with better oxidation resistance. The choice depends on pad pitch, storage period and assembly requirements.