Double-sided green lead-free tin-plated through-hole board with a semi-hole structure that has been electroplated, forming a 360° fully encapsulated conductive layer, effectively enhancing the welding strength of the hole walls and the stability of signal transmission. The board is treated with lead-free tin plating process, ensuring environmental compliance while providing excellent solderability and oxidation protection for the semi-hole pins. This product is particularly suitable for communication gateways, industrial IoT edge computing terminals, and high-density integrated instruments that require direct board-to-board insertion. It effectively saves connector space and improves system integration.
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Material |
FR-4, aluminium-based, ceramic, metal, copper-based, high-frequency, rigid-flex combined, halogen-free |
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Board thickness |
0.3 - 6mm |
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Copper thickness |
0.5oz - 5oz |
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Number of layers |
1 - 32 layers |
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Origin |
Anhui, China |
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Surface treatment |
Ordinary tin plating, lead-free tin plating, OSP, nickel/gold plating, blue tape, silver plating, tin plating |
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Minimum hole diameter |
0.25mm |
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Minimum line width |
3mil (0.075mm) |
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Minimum line spacing |
0.075mm |
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Ratio of board thickness to hole diameter |
10:26 |