Double-sided black lead-free soldered board, with matte black solder mask layer and lead-free soldering process: The soldering surface layer has the "low-temperature rapid immersion" characteristic, and can still stably solder in the 240℃ low-temperature welding environment, suitable for the fine assembly of heat-sensitive components; The black solder mask layer has a slight anti-slip texture, which is convenient for fixing the board during manual assembly on the production line, while covering the circuit details without leaving fingerprints, improving the appearance tidiness of the finished product. The board body is made of flame-retardant FR-4 substrate, and is equipped with a wide-width circuit design, suitable for the current-carrying requirements of large current components.
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Material |
FR-4, aluminium-based, ceramic, metal, copper-based, high-frequency, rigid-flex combined, halogen-free |
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Board thickness |
0.3 - 6mm |
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Copper thickness |
0.5oz - 5oz |
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Number of layers |
1 - 32 layers |
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Origin |
Anhui, China |
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Surface treatment |
Ordinary tin plating, lead-free tin plating, OSP, nickel/gold plating, blue tape, silver plating, tin plating |
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Minimum hole diameter |
0.25mm |
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Minimum line width |
3mil (0.075mm) |
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Minimum line spacing |
0.075mm |
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Thickness-to-diameter ratio of holes |
10:13 |