Double-sided green lead-free soldered board, featuring a high coverage green solder mask layer combined with lead-free soldering process. The solder layer is uniform, dense and highly resistant to sulfidation. The green appearance precisely matches the visual positioning of the automated assembly line. The board body is made of flame-retardant FR-4 substrate, supporting a large hole diameter design and power component packaging, meeting the requirements for large current transmission in industrial equipment. It is a practical PCB solution that combines industrial reliability and production efficiency.
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Material |
FR-4, aluminium-based, ceramic, metal, copper-based, high-frequency, rigid-flex combined, halogen-free |
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Board thickness |
0.3 - 6mm |
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Copper thickness |
0.5oz - 5oz |
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Number of layers |
1 - 32 layers |
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Origin |
Anhui, China |
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Surface treatment |
Ordinary tin plating, lead-free tin plating, OSP, nickel/gold plating, blue tape, silver plating, tin plating |
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Minimum hole diameter |
0.25mm |
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Minimum line width |
3mil (0.075mm) |
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Minimum line spacing |
0.075mm |
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Ratio of board thickness to hole diameter |
10:24 |