Double-sided green lead-free tin-plated board. The thick metal barrier formed by the tin coating has excellent heat dissipation performance and the ability to handle large currents, which can effectively cope with power fluctuations and thermal stress impacts. The unique microscopic rough structure on the surface can enhance the mechanical bite force of the solder joints during welding, forming an extremely strong connection point, significantly improving the product's shock resistance and long-term reliability.
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Material |
FR-4, aluminium-based, ceramic, metal, copper-based, high-frequency, rigid-flex combined, halogen-free |
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Board thickness |
0.3 - 6mm |
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Copper thickness |
0.5oz - 5oz |
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Number of layers |
1 - 32 layers |
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Origin |
Anhui, China |
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Surface treatment |
Ordinary tin plating, lead-free tin plating, OSP, nickel/gold plating, blue tape, silver plating, tin plating |
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Minimum hole diameter |
0.25mm |
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Minimum line width |
3mil (0.075mm) |
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Minimum line spacing |
0.075mm |
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Ratio of board thickness to hole diameter |
10:20 |