Double-sided green lead-free tin-plated board, with FR-4 base material selected for the board body, and an optimized copper foil layout for efficient heat dissipation, which can quickly disperse the heat generated by components, preventing performance degradation caused by high temperatures. The edges adopt precise V-CUT board splitting design, resulting in no burrs or warping after splitting, suitable for the batch assembly requirements of small and medium-sized electronic modules. The circuit conduction stability is excellent. The core advantages focus on "high-speed production compatibility + efficient heat dissipation protection + environmentally friendly and durable", applicable to scenarios such as smart home control boards, industrial sensor interface boards, automotive low-voltage modules, and batch consumer electronic power modules, etc. It is a cost-effective PCB solution that balances production efficiency, usage stability, and environmental compliance.
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Material |
FR-4, aluminium-based, ceramic, metal, copper-based, high-frequency, rigid-flex combined, halogen-free |
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Board thickness |
0.3 - 6mm |
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Copper thickness |
0.5oz - 5oz |
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Number of layers |
1 - 32 layers |
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Origin |
Anhui, China |
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Surface treatment |
Ordinary tin plating, lead-free tin plating, OSP, nickel/gold plating, blue tape, silver plating, tin plating |
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Minimum hole diameter |
0.25mm |
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Minimum line width |
3mil (0.075mm) |
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Minimum line spacing |
0.075mm |
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Ratio of board thickness to hole diameter |
10:21 |