Double-sided red OSP board, using the anti-oxidation (OSP) process, forms an extremely thin protective film on the copper pads, providing excellent flatness and consistency for precise soldering of ultra-small gap components and lead-free processes. The distinct red solder mask not only gives the product a unique market recognition, but also facilitates optical positioning and quality inspection during the production process. This product is an ideal choice for high-end network equipment, miniaturized consumer electronics, precision instruments, and digital circuits that require both fine soldering and excellent appearance quality.
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Material |
FR-4, aluminium-based, ceramic, metal, copper-based, high-frequency, rigid-flex combined, halogen-free |
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Board thickness |
0.3 - 6mm |
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Copper thickness |
0.5oz - 5oz |
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Number of layers |
1 - 32 layers |
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Origin |
Anhui, China |
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Surface treatment |
Ordinary tin plating, lead-free tin plating, OSP, nickel/gold plating, blue tape, silver plating, tin plating |
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Minimum hole diameter |
0.25mm |
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Minimum line width |
3mil (0.075mm) |
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Minimum line spacing |
0.075mm |
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Ratio of board thickness to hole diameter |
10:22 |