The double-sided black OSP PCB board is produced in batches using the laminated technology. The black solder mask layer is combined with OSP surface treatment, which not only ensures the stability of soldering and oxidation resistance, but also achieves line concealment through the matte black appearance, suitable for the structural design of small and precise electronic devices. The onboard precise pads and positioning holes layout supports efficient assembly of surface mount components, is compatible with the automatic production line soldering process, and the OSP process complies with environmental protection standards. The product is suitable for scenarios such as consumer small electronic modules and intelligent sensors, featuring high production consistency, excellent soldering yield, and a balance between appearance and practicality. It is a highly adaptable PCB solution for small and precise electronic products.
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Material |
FR-4, aluminium base, ceramic, metal, copper base, high frequency, rigid-flex combined, halogen-free |
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Board thickness |
0.3 - 6mm |
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Copper thickness |
0.5oz - 5oz |
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Number of layers |
1 - 32 layers |
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Origin |
Anhui, China |
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Surface treatment |
Ordinary tin plating, lead-free tin plating, OSP, nickel/gold plating, blue tape, silver plating, tin plating |
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Minimum hole diameter |
0.25mm |
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Minimum line width |
3mil (0.075mm) |
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Minimum line spacing |
0.075mm |
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Ratio of board thickness to hole diameter |
10:8 |