The double-sided black OSP board features a high-density and fine-line design. The line width and spacing can be precisely controlled to 2.5mil/2.5mil. It is equipped with micro surface mount pads, which meets the requirements of miniaturized chip packaging. The black OSP surface has a strong matte texture, which not only avoids assembly reflection interference but also ensures the stability of active welding at high temperatures. It is compatible with 0.2mm micro hole diameter processes. The product uses a high-Tg substrate and has passed micro stress tests to be suitable for precise component welding. It is widely used in core modules of smart wearables, micro sensor circuits, etc., and is the preferred PCB solution for small-sized and highly integrated electronic devices.
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Material |
FR-4, aluminium-based, ceramic, metal, copper-based, high-frequency, rigid-flex combined, halogen-free |
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Board thickness |
0.3 - 6mm |
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Copper thickness |
0.5oz - 5oz |
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Number of layers |
1 - 32 layers |
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Origin |
Anhui, China |
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Surface treatment |
Ordinary tin plating, lead-free tin plating, OSP, nickel/gold plating, blue tape, silver plating, tin plating |
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Minimum hole diameter |
0.25mm |
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Minimum line width |
3mil (0.075mm) |
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Minimum line spacing |
0.075mm |
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Ratio of board thickness to hole diameter |
10:9 |