Double-sided greenized gold plated board, using vacuum precision gold plating technology, the gold plating surface adopts ultra-thin uniform coating technology, with the gold layer thickness precisely controlled within 0.05 - 0.1 μm. This not only maintains excellent conductivity and solderability, but also significantly reduces the cost of precious metals. After high-temperature aging tests, it still shows no oxidation or color change. The board body selects high insulation FR-4 base material, combined with an optimized grounding layer design, effectively suppressing electromagnetic interference. It supports stable transmission of industrial-grade medium-low speed signals and is compatible with through-hole and surface-mount hybrid packaging, meeting the integration requirements of various types of components. It is suitable for industrial control auxiliary boards, smart home sensor modules, batch consumer electronic interface boards, front-end circuits of security monitoring, etc. It is a cost-effective PCB solution that balances production economy, production efficiency, and usage stability.
|
Material |
FR-4, aluminium-based, ceramic, metal, copper-based, high-frequency, rigid-flex combined, halogen-free |
|
Board thickness |
0.3 - 6mm |
|
Copper thickness |
0.5oz - 5oz |
|
Number of layers |
1 - 32 layers |
|
Origin |
Anhui, China |
|
Surface treatment |
Ordinary tin plating, lead-free tin plating, OSP, nickel/gold plating, blue tape, silver plating, tin plating |
|
Minimum hole diameter |
0.25mm |
|
Minimum line width |
3mil (0.075mm) |
|
Minimum line spacing |
0.075mm |
|
Thickness-to-diameter ratio of holes |
10:17 |