A four-layer double-sided PCB board, employing advanced half-hole (half-buried hole) technology and green solder mask combined with electroless gold plating (ENIG) surface treatment, is specifically designed for high-end electronic products with strict requirements for space and reliability. Its core advantages lie in: The half-hole design achieves precise electrical connections at the module edges, significantly enhancing assembly density and integration; The electroless gold plating surface provides excellent flatness, weldability, and oxidation resistance for the pads, ensuring long-term reliability; The four-layer structure provides a stable power layer and a complete ground plane, effectively optimizing signal integrity and suppressing electromagnetic interference. This board is an ideal choice for communication modules, industrial control motherboards, high-end consumer electronics, and portable medical equipment, among others.
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Material |
FR-4, aluminium-based, ceramic, metal, copper-based, high-frequency, rigid-flex combined, halogen-free |
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Board thickness |
0.3 - 6mm |
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Copper thickness |
0.5oz - 5oz |
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Number of layers |
1 - 32 layers |
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Origin |
Anhui, China |
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Surface treatment |
Ordinary tin plating, lead-free tin plating, OSP, nickel/gold plating, blue tape, silver plating, tin plating |
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Minimum hole diameter |
0.25mm |
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Minimum line width |
3mil (0.075mm) |
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Minimum line spacing |
0.075mm |
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Ratio of board thickness to hole diameter |
10:3 |