Four-layer double-sided green OSP boards, using high-reliability FR-4 base material and environmentally friendly OSP surface treatment, the green solder mask layer conforms to the visual standards of mass production in the PCB industry. It can seamlessly adapt to the automatic production line's soldering and inspection processes, significantly improving the production efficiency of batch production. The organic protective film formed by the OSP process has high temperature resistance and strong oxidation resistance, can precisely avoid the risk of welding short circuits, and with the four-layer optimized layering design, realizes efficient isolation of power and signal lines, effectively reducing signal crosstalk, and ensuring stable transmission of medium and high-speed circuits. The product supports flexible customization of board thickness, copper thickness, and fine line specifications, is compatible with various packaging processes, has undergone strict environmental reliability tests, and is suitable for mass production scenarios in industrial control, consumer electronics, security equipment, etc. It is a high-quality PCB solution that combines high cost performance, stable performance, and environmental compliance.
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Material |
FR-4, aluminium-based, ceramic, metal, copper-based, high-frequency, rigid-flex combined, halogen-free |
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Board thickness |
0.3 - 6mm |
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Copper thickness |
0.5oz - 5oz |
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Number of layers |
1 - 32 layers |
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Origin |
Anhui, China |
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Surface treatment |
Ordinary tin plating, lead-free tin plating, OSP, nickel/gold plating, blue tape, silver plating, tin plating |
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Minimum hole diameter |
0.25mm |
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Minimum line width |
3mil (0.075mm) |
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Minimum line spacing |
0.075mm |
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Ratio of board thickness to hole diameter |
10:6 |