High-speed PCB boards utilize ultra-low-loss substrates and precision impedance control technology, designed specifically for GHz-level high-speed signal transmission. They effectively reduce signal attenuation and crosstalk, ensuring data integrity and transmission stability. Through strict dielectric constant consistency control (Dk±0.05) and ultra-fine line processing (minimum line width/spacing of 3 mils), they meet the requirements of high-speed protocols such as PCIe 5.0 and DDR5, and are widely used in cutting-edge fields such as AI servers, data center switches, high-end graphics cards, and 5G communication equipment. Combined with an optimized stack-up design and differential pair wiring, this board can achieve high-speed signal transmission exceeding 28Gbps. It is a core carrier for processing large data traffic and ultra-high-frequency operations, and is particularly suitable for high-performance computing scenarios that are sensitive to signal timing and power consumption.
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Materials |
FR-4, aluminum, ceramic, metal, copper, high-frequency, rigid-flex, halogen-free |
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Board thickness |
0.3-6mm |
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Copper thickness |
0.5oz-5oz |
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Layers |
1-32 |
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Place of origin |
Anhui, China |
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Surface finish |
Standard HASL, lead-free HASL, OSP, immersion nickel/gold, blue glue, immersion silver, immersion tin |
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Minimum aperture |
0.25mm |
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Minimum trace width |
3mil (0.075mm) |
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Minimum trace spacing |
0.075mm |
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Board thickness to aperture ratio |
10:1 |