High-frequency PCBs utilize specialized materials with low dielectric constants (Dk) and dissipation factors (Df), such as PTFE and ceramic fillers, to significantly reduce signal transmission loss and latency, ensuring the integrity and stability of high-frequency signals. Their superior impedance control (tolerance ±5%) and temperature stability enable them to excel in high-frequency applications such as 5G communication base stations, millimeter-wave radar, satellite communications, high-speed digital circuits, and RF modules. High-frequency PCBs support ultra-fine line designs (line widths/line spacings up to 50μm) and exhibit excellent anti-interference performance, making them core components for high-speed, high-precision signal transmission in high-end communications equipment, aerospace electronics, and automotive radar systems.
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Materials |
FR-4, aluminum, ceramic, metal, copper, high-frequency, rigid-flex, halogen-free |
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Board thickness |
0.3-6mm |
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Copper thickness |
0.5oz-5oz |
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Layers |
1-32 |
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Place of origin |
Anhui, China |
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Surface finish |
Standard HASL, lead-free HASL, OSP, immersion nickel/gold, blue glue, immersion silver, immersion tin |
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Minimum aperture |
0.25mm |
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Minimum trace width |
3mil (0.075mm) |
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Minimum trace spacing |
0.075mm |
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Board thickness to aperture ratio |
10:1 |
Black High-Frequency PCB is an RF/microwave circuit board built upon low-loss high-frequency substrates with black solder mask. It aims to minimize signal loss and phase delay for high-frequency circuits. Substrate selection, stack-up structure and impedance parameters need to be reviewed against customer Gerber files and target frequency-band requirements.
Q: What substrate choices are available for black high-frequency PCB?
A: Main options cover PTFE, ceramic-filled composite material, and hybrid stack-up combining high-frequency material with ordinary FR4.