Metal substrates utilize aluminum, copper, and other metals as their core thermally conductive layer. A specialized insulating dielectric achieves superior heat dissipation performance (thermal conductivity 1-400W/mK), significantly reducing the operating temperature of high-power devices. The metal base layer combines high strength with electromagnetic shielding properties, supporting high current transmission. They are widely used in high-heat-density applications such as LED lighting, automotive electronics, power modules, and industrial control equipment. This board effectively addresses the insufficient heat dissipation of traditional FR4 materials, improving system stability and extending component life. It is particularly well-suited for power electronics designs requiring efficient thermal management and is a key cooling solution for new energy, 5G base stations, and high-power laser equipment.
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Materials |
FR-4, aluminum, ceramic, metal, copper, high-frequency, rigid-flex, halogen-free |
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Board thickness |
0.3-6mm |
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Copper thickness |
0.5oz-5oz |
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Layers |
1-32 |
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Place of origin |
Anhui, China |
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Surface finish |
Standard HASL, lead-free HASL, OSP, immersion nickel/gold, blue glue, immersion silver, immersion tin |
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Minimum aperture |
0.25mm |
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Minimum trace width |
3mil (0.075mm) |
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Minimum trace spacing |
0.075mm |
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Board thickness to aperture ratio |
10:1 |