Aluminum-based PCBs utilize aluminum as their core heatsink layer, combined with a highly thermally conductive insulating medium. This provides excellent heat dissipation and mechanical strength, effectively reducing the operating temperature of high-power devices. With a thermal conductivity of 1-3W/mK, far exceeding that of traditional FR4 substrates, they are particularly well-suited for applications requiring efficient heat dissipation, such as LED lighting, power modules, automotive electronics, and high-power devices. The aluminum substrate combines lightweight and impact resistance, supports single-sided wiring, and offers excellent stability in high-temperature environments, significantly extending component life. It is a cost-effective metal substrate solution for addressing heat dissipation challenges.
|
Material |
Aluminum |
|
Supplier |
Shengyi |
|
Thickness |
1.6" |
|
Thermal Conductivity |
2W |
|
Finished Copper Thickness |
36µm |
|
Solder Mask |
Black |
|
Texture |
White |
|
Surface Finish |
OSP |
|
Finished Dimensions |
301mm x 279mm |