Aluminum-based PCBs utilize aluminum as their core heatsink layer, combined with a highly thermally conductive insulating medium. This provides excellent heat dissipation and mechanical strength, effectively reducing the operating temperature of high-power devices. With a thermal conductivity of 1-3W/mK, far exceeding that of traditional FR4 substrates, they are particularly well-suited for applications requiring efficient heat dissipation, such as LED lighting, power modules, automotive electronics, and high-power devices. The aluminum substrate combines lightweight and impact resistance, supports single-sided wiring, and offers excellent stability in high-temperature environments, significantly extending component life. It is a cost-effective metal substrate solution for addressing heat dissipation challenges.
|
Material |
Aluminum |
|
Supplier |
Shengyi |
|
Thickness |
1.6" |
|
Thermal Conductivity |
2W |
|
Finished Copper Thickness |
36µm |
|
Solder Mask |
Black |
|
Texture |
White |
|
Surface Finish |
OSP |
|
Finished Dimensions |
301mm x 279mm |
This double-sided PCB combines a matte black solder mask with a customer-specified gold-related surface finish. Before publishing the page, clarify whether “gold plating” refers to ENIG, electroplated gold, or selective gold plating. These processes differ in construction, application, and technical requirements and should be described accurately.
Q: Are ENIG and electroplated gold the same process?
A: No. They differ in process structure, typical applications, and technical requirements. The page should use the name that matches the actual manufacturing process.