This four-layer tin-spray PCB utilizes an FR-4 substrate and a hot-air leveling tin-spray process, achieving a cost-effective multi-layer interconnect solution within a four-layer circuit structure, combining excellent conductivity and solderability. Its precise stack-up design and built-in power and ground planes effectively reduce signal interference and enhance circuit stability, with an operating temperature range of -50°C to 130°C. The tin-spray surface treatment provides excellent oxidation resistance and pad flatness, supporting both SMT and wave soldering processes. It is widely used in industrial control equipment, smart home systems, automotive electronic modules, and consumer electronics. While ensuring signal integrity, this board significantly reduces production costs, making it an ideal choice for medium-complexity electronic devices such as LED control drivers and power management modules. It is particularly well-suited for mass production projects that balance performance and budget.
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Materials |
FR-4, aluminum, ceramic, metal, copper, high-frequency, rigid-flex, halogen-free |
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Board thickness |
0.3-6mm |
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Copper thickness |
0.5oz-5oz |
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Layers |
1-32 |
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Place of origin |
Anhui, China |
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Surface finish |
Standard HASL, lead-free HASL, OSP, immersion nickel/gold, blue glue, immersion silver, immersion tin |
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Minimum aperture |
0.25mm |
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Minimum trace width |
3mil (0.075mm) |
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Minimum trace spacing |
0.075mm |
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Board thickness to aperture ratio |
10:1 |